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With over 25 years of experience in PCB assembly services, Macrotron provides flexible manufacturing options that adapt to cost targets, delivery requirements and fluctuating demands in volume. We cover a range of services such as:

» Automation systems
» Low to high volume surface mount and through-hole PCB assembly
» 01005s ,BGA, uBGA, CCGA CSP and Flip Chip
» 0.4mm Fine Pitch Devices
» Multi-Layered PC Board (24 layers)
» Prototype and pre-production electronic assembly

We also specialize in ISO compliant processes such as:

» Surface Mount Technology (Paste and Epoxy)
» Encapsulation and conformal coating of PCB assemblies
» Lead-Free assembly
» Intrusive reflow
» Press fit
» Wave/Selective wave soldering
» Double/Single-sided reflow processing
» Water soluble and no-clean processes
» Rework and repairs (Fine Pitch QFP, Area Array Packages)
» Functional, electrical, and in-circuit testing

By managing the concept to production process, we enable our customers to concentrate on their core specialties.